Telit Wireless Solutions is launching the first Telit GSM/GPRS module with LCC (Leadless Chip Carrier) castellation packaging technology, the GL865-DUAL, in October 2010. Its ultra-small form factor, excellent energy efficiency and low unit price make this module perfect for mobile applications and high-volume use across all industries.

Features:

• Are surface mount package devices, which use metalized pads on the sides of the package
• Areas of application include medical monitoring equipment, miniaturized security systems and the tracking of people, animals and objects
• Ideally suited for uncomplicated and low-cost applications based on Four-Layer PCB (printed circuit board)
• With the option for manual soldering and removal, it can also serve niche applications with a low volume production
• Built-in features such as the integrated TCP/IP protocol stack, a serial multiplexer and remote AT commands extend the application's range of functions without incurring any additional costs

In a press release, Sandro Spanghero, global VP of Research and Development at Telit, said, "M2M becomes more and more relevant to all aspects of everyday life and business and turns into a mass market. Therefore it is essential to provide clients with an infrastructure that is capable to meet the upcoming requirements. Keeping up this trend and expanding our portfolio with a product that is ideally suited for the mass market as well as for specialized products makes us well prepared for the future."

The company offers its broad family of M2M modules with BGA packaging. This is particularly relevant for the automotive and telematics market. BGA is a packaging with one face covered with balls in a grid pattern and therefore, requires in comparison to the LCC castellation packaging smaller space. The BGA is also more efficient in regard of number of inputs and outputs.

Spanghero continued, "Our core strategy is to offer the whole spectrum of relevant wireless technologies, products and services. Therefore it is an important step for our portfolio development to offer now the LCC castellation packaging at the same time as our successful and well-known BGA packaging. LCC and BGA packaging complement each other as they serve different market segments, for which reason this is a great addition to our portfolio."

The GL865-DUAL offers GSM/GPRS functionality from a tiny, compact module. Its low unit price and inexpensive surface mount assembly allow it to be used in low-cost equipment. The GL865-DUAL is an entry-level product aimed at EMEA and APAC markets.

In addition, the GL865-DUAL also features premium FOTA management that enables radio-controlled firmware updates to be carried out.

Sujata Garud is a TMCnet freelancer with three years of writing/editing experience and two years of market research experience. As an editor she has covered the IT, electronics, banking, pharma, construction, mining and healthcare industries. To see more of her articles, please visit her columnist page.

Edited by Jaclyn Allard