Quake Global, Inc., a manufacturer of satellite data modems for tracking, monitoring, and controlling industrial assets, has selected Telit’s GE865-QUAD, which is claimed to be the world’s smallest GSM/GPRS M2M communications module, to remotely connect QUAKE’s Q-Pro and Q4000 smart modems to cellular networks for expanded asset tracking and increased reliability.

“While the miniature size of Telit’s module allowed us to design even more compact asset tracking devices, our selection was ultimately based on Telit’s proven record around its Ball-Grid Array, or BGA, installation concept, low power draw, and excellent design support,” said Sergio Ramos, chief technology officer of Quake Global, Inc, in a statement.

Ramos said that Telit’s commitment to quality will enable the company to deliver effective, reliable products to the customers.

“QUAKE’s impressive list of customers, which is comprised of the world’s most recognized brand names in the construction and heavy equipment market, is built upon their deep experience in developing global asset tracking technology,” said Michael Ueland, vice-president and general manager of Telit Wireless (News - Alert) Solutions.

Ueland said that the selection of the company’s module represents an important milestone in the launch of GE865-QUAD product and a testament of Telit innovation.

Telit Wireless Solutions, Inc. is the U.S.-based mobile technology arm of Telit Communications (News - Alert).

Officials with Telit said that GE865-QUAD is one of the company’s first products to incorporate a next-generation quad-band GSM/GPRS chipset from Infineon, providing the basis for the module’s innovative single-chip design solution.

The module also features tape and reel packaging and an integrated TCP/IP protocol stack that provides support for UDP (News - Alert), FTP and SMTP via AT commands.

Company officials said that equipped with Premium FOTA Management, the GE865-QUAD can receive over-the-air remote software updates.

Additionally, since Telit owns and controls the firmware within its modules, any changes to underlying chipsets will have minimal impact on customers’ application designs.